| 摘要 |
<p>PURPOSE:To provide a semiconductor device which is provided with a high heat-dissipating characteristic and in which the close adherence property of a heat-dissipating member to a sealing resin is enhanced and to provide its manufacturing method. CONSTITUTION:A meshlike member 12 is arranged, installed and fixed at the inside of a sealing resin 17, and a cap 10 on which a radiation fin 11 is erected and installed is attached to the upper part of the sealing resin 17. As a result, the close adherence property of the cap 10 to the sealing resin 17 becomes firm, it is possible to prevent the cap 10 from being separated and detached due to repeated use, and a high heat-dissipating effect by the radiation fin 11 is achieved. In addition, in a manufacturing method, the cap 10 is placed on a lower metal mold, a lead frame 15 on which a semiconductor element 13 is mounted is arranged at the upper part of the cap 10, and the cap 10 and the semiconductor element 13 are sealed simultaneously with the sealing resin 17. As a result, a degree of skill for a manufacturing technique is not required, and a semiconductor device is not damaged.</p> |
