| 摘要 |
<p>PURPOSE:To provide an electronic component having stabilized quality by preventing the solder layer on a semiconductor element and contaminants, e.g. flux, contained therein from adhering to an insulation layer on the semiconductor device thereby preventing the leakage. CONSTITUTION:In an electronic device wherein a semiconductor element having a metal layer, at least on the upper face thereof, is sandwiched by two lead terminals 4 through a solder 3, a bump 7 is formed between the metal layer and the solder layer on the inside of the metal layer forming region.</p> |
