发明名称 STACKING OF CIRCUITED POLYMER DIELECTRIC PANEL
摘要 PURPOSE: To provide a method for electrically connecting pads together between panels and laminating high-molecular circuit dielectric panels. CONSTITUTION: The electric connection between pads is provided by the instantaneous liquid phase formation coupling of connecting metal featured by the composition of a non-eutectic stoichiometry in an eutectic formation system. The eutectic temperature of the system is lower than the primary transient temperature of a high-molecular dielectric 233 and the melting point of the coupling metal composition is higher than the prinary transient temperature of the high-molecular dielectric 223.
申请公布号 JPH07105144(A) 申请公布日期 1995.04.21
申请号 JP19940142789 申请日期 1994.06.24
申请人 INTERNATL BUSINESS MACH CORP <IBM> 发明人 REIMONDO TOOMASU GARASUKO;JIYAINARU ABEDEIN MORA
分类号 G06F15/173;G06F15/80;G11C5/00;H01L23/48;H01L23/52;H05K1/00;H05K3/00;H05K3/32;H05K3/46 主分类号 G06F15/173
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