发明名称 |
STACKING OF CIRCUITED POLYMER DIELECTRIC PANEL |
摘要 |
PURPOSE: To provide a method for electrically connecting pads together between panels and laminating high-molecular circuit dielectric panels. CONSTITUTION: The electric connection between pads is provided by the instantaneous liquid phase formation coupling of connecting metal featured by the composition of a non-eutectic stoichiometry in an eutectic formation system. The eutectic temperature of the system is lower than the primary transient temperature of a high-molecular dielectric 233 and the melting point of the coupling metal composition is higher than the prinary transient temperature of the high-molecular dielectric 223. |
申请公布号 |
JPH07105144(A) |
申请公布日期 |
1995.04.21 |
申请号 |
JP19940142789 |
申请日期 |
1994.06.24 |
申请人 |
INTERNATL BUSINESS MACH CORP <IBM> |
发明人 |
REIMONDO TOOMASU GARASUKO;JIYAINARU ABEDEIN MORA |
分类号 |
G06F15/173;G06F15/80;G11C5/00;H01L23/48;H01L23/52;H05K1/00;H05K3/00;H05K3/32;H05K3/46 |
主分类号 |
G06F15/173 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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