| 摘要 |
<p>PURPOSE:To prevent crack and break of a wafer when the water is divided into individual chips. CONSTITUTION:In the semiconductor manufacturing method for dividing a wafer 1, on one surface of which streets 2 are formed, into individual chips 5, dicing trenches 3 having a specified depth are formed along the streets on the one surface of the wafer 1. Next the other surface of the wafer 1 is ground, and the wafer 1 is divided into individual chips 5 while applying the previously formed dicing trenches 3 to boundaries.</p> |
