| 摘要 |
<p>PURPOSE:To prevent the defect of a multi-chip module due to defective chips, while eliminating the step of replacing defective chips in modules. CONSTITUTION:IC chips 3a and 3b are held with an arm 7 in such a manner that they are corresponding to their actual mounting positions on an interconnection substrate 2. The arm is driven and electrodes 18 of the chips are temporarily brought into electrical contact with their corresponding test electrodes 15 formed on a replica 8 of the substrate 2. In this manner, chips for a munti-chip module are subjected to functional tests through the electrodes 15. Accepted chips are carried by the arm and mounted on the substrate 2.</p> |
