| 摘要 |
PURPOSE:To make it possible to perform reliably the wire bonding of a semiconductor chip in a tabless lead frame by a method wherein second wires, which connect mechanically the dummy electrode parts of the chip with second leads which are dummy electrodes, are provided for fixing the chip. CONSTITUTION:A semiconductor device, which consists of a tabless lead frame 2, has first wires 3 for connecting electrically electrode parts 1a of a semiconductor chip 1 with terminals of first leads 2a for connecting electrically with external terminals. Moreover, the device is constituted in such a way as to have second wires 4, which connect mechanically dummy electrode parts 1b of the chip 1 with second leads 2b which are dummy terminals, for fixing the chip 1. For example, the dummy electrode parts 1b formed at the corner parts of the chip 1 and the end parts, which are formed in the vicinities of the dummy electrode parts 1b, of the dummy leads 2b are mechanically connected with each other by the wires 4 having a rigidity higher than that of the wires 3. |
