发明名称 FORMATION OF PATTERN
摘要 <p>PURPOSE:To provide a method of forming resist patterns, which can easily obtain the resist patterns having a fine form and a vertical sectional form. CONSTITUTION:A resist film 2, which senses to an energy beam 1, is formed on a substrate, the energy beam 1 of the form of a pattern is emitted on the film 2, X-ray absorbing molecules 4 having an absorption coefficient larger than that of the film 2 to X-rays of a desired wavelength are selectively introduced in emitted parts of the film 2 and the film 2 is subjected to entire surface exposure with these X-rays 6 of the desired wavelength and is developed to obtain resist patterns 7. There are both the case where the molecules 4 are introduced in the emitted parts of the film 2 and the case where the molecules 4 are introduced in the non-emitted part of the film 2.</p>
申请公布号 JPH07106228(A) 申请公布日期 1995.04.21
申请号 JP19930248393 申请日期 1993.10.05
申请人 HITACHI LTD 发明人 FUKUDA HIROSHI
分类号 G03F1/16;G03F7/20;H01L21/027;(IPC1-7):H01L21/027 主分类号 G03F1/16
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