| 摘要 |
<p>PURPOSE:To realize a high-density mounting operation and a good heat- dissipating function by a method wherein the tip of a thin outer lead is bent in such a way that its rear surface becomes the same face as the rear surface of a sealing resin. CONSTITUTION:When a resin-sealed semiconductor device is mounted on, and attached to, a circuit board, the rear surface of every tip part of individual outer lead terminal 15, 17, 18 is connected, by means of solder, to a copper foil on the circuit board for mounting. Thereby, the rear surface of a resin- sealed region 23 adheres closely to the circuit board, heat generated at the inside of a transistor 19 is dissipated via an element mounting part 14, a sealing resin and the circuit board. In addition, the outer lead terminal 15 for a collector and the outer lead terminals 17, 18 other than it are arranged so as to divided into both sides of the element mounting part 14. As a result, in a state that every tip of the individual outer lead terminals 15, 17, 18 is connected to the circuit board, the whole region on the rear surface of the sealing resin adheres closely to the surface of the circuit board. As a result, it is possible to obtain a heat-dissipating effect which is not inferior to that by fixing with screws.</p> |
