发明名称 MANUFACTURE OF MULTILAYERED LEAD FRAME
摘要 PURPOSE:To enhance the production efficiency by making dies unnecessary for producing the shape of an insulation material for a multilayered lead frame and by easily and reliably forming holes for promoting the running of a resin and spot portions for welding power supply pins as predetermined openings. CONSTITUTION:A photosensitive insulation resist 2 is used as etching resist for making parts by etching a metal plate on a metal plate 1 of either radiation plate, power supply plane or grounding plane, and a photosensitive insulation resist 2, on which a resin mold opening 4, an opening 5 for welding point and other were patterned, is used as an insulation layer 2a without being peeled off after the etching.
申请公布号 JPH07106505(A) 申请公布日期 1995.04.21
申请号 JP19930269480 申请日期 1993.10.04
申请人 DAINIPPON PRINTING CO LTD 发明人 MORITA MICHIHIKO;SAGARA HIDEJI
分类号 C23F1/00;H01L23/50;(IPC1-7):H01L23/50 主分类号 C23F1/00
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