| 摘要 |
PURPOSE:To reduce the connecting distance between the terminals of electronic components without increasing the number of wiring layers. CONSTITUTION:A multilayered printed board has at least two wiring layers and a wiring pattern composed of X-conductor segments (X1, X2, X3, and X4) having X-components is formed on one wiring layer. Then another wiring pattern composed of Y-conductor segments (Y1, Y2, Y3, and Y4) having Y- components is formed on the other wiring layer and both patterns are suitably connected to each other through via holes (16 and 18). Wiring patterns composed of inclined conductor segments (XY1, XY2, XY3, and XY4 and YX1, YX2, YX3, and YX4) respectively having resultant XY- and YX-components are formed in the blanks areas of the wiring patterns on the wiring layers and the inclined conductor segments of both wiring patterns are suitably connected to each other through via holes (20, 22 and 24 and 26, 28, and 30). |
