发明名称 LEAD FRAME OF SEMICONDUCTOR INTEGRATED CIRCUIT
摘要 PURPOSE:To restrain a reduction in the size of a dam bar between outer leads even when a pitch between the outer leads is small and to easily cut and remove the dam bar even when the density of a semiconductor integrated circuit becomes high. CONSTITUTION:Outer leads 5a, 5b for a lead frame 100 are provided with left- sided parts 5a-1, 5b-2 and right-sided parts 5a-2, 5b-1. Dam bars 1A connect the left-sided parts 5a-1 to the right-sided parts 5b-1 and dam bars 1B connect the left-sided parts 5a-2 to the left-sided parts 5b-2 which are adjacent to the left side of the right-sided parts 5a-2. Thereby, the dam bars are installed in the maximum distance X between the outer leads, and the size Z of the dam bars can be increased.
申请公布号 JPH07106488(A) 申请公布日期 1995.04.21
申请号 JP19930247827 申请日期 1993.10.04
申请人 SHARP CORP 发明人 NAKANISHI HIROYUKI
分类号 H01L23/50;H01L23/495;(IPC1-7):H01L23/50 主分类号 H01L23/50
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