| 摘要 |
<p>PURPOSE:To form lead terminals having the same form and the same capacitance to make possible the high-speed operation of a semiconductor device with an external device without increasing the area of a semiconductor pellet. CONSTITUTION:An element region 2 is formed on a semiconductor pellet 1 and a bonding pad region 3, within which all of bonding ppds 4 to be connected to one side of this region 2 via an element and a wiring within the region 2 can be arranged, is formed in such a way that the region 2 is positioned on the center of the region 3 and lead terminals 5 of the same form and the same capacitance are respectively connected to the arranged pads 4 via bonding wires 6.</p> |
