| 摘要 |
PURPOSE:To make a semiconductor device thin by a method wherein a semiconductor element is mounted on, and attached to, an insulating sheet and an electrode is connected electrically to a lead terminal by using an auxiliary lead terminal. CONSTITUTION:A semiconductor element 12 is mounted on, and attached to, according to a facedown system, the center of a sheet face 17 on one side of a wiring sheet 16 composed of an insulating material. In addition, many auxiliary lead terminals 18 formed of a conductive thin film are formed radially on the sheet face 17 on one side of the wiring sheet 16, end parts on one side come into contact with bump electrodes for the semiconductor element 12, and end parts on the other side come into contact with base end parts of lead terminals 14. In addition, base end parts of the lead terminals 18 are sealed with a package 13 together with the semiconductor element 12 and the wiring sheet 16, and other parts of the leads protrude nearly vertically from the package 13 and molded to be a gull wing shape. Metal thin wires can be omitted, and a semiconductor device can be made thin without lowering the mechanical strength of the lead terminals for the semiconductor element. |
