| 摘要 |
PURPOSE:To enable a plurality of semiconductor chips in a adjacent state to be surely and stably packaged by a method wherein the plurality of semiconductor chips are close bonded one by one while being heated on a semi-set bonding agent and then the bonding agent layer is to be completely set. CONSTITUTION:A plurality of semiconductor chips 16, 17 in a adjacent state with each other are packaged on the semiconductor chip packaging part 13 of a package 11 using a bonding agent to manufacture a semiconductor device. At this time, the semiconductor chip packaging part 13 is coated with a bonding agent to form a bonding agent layer 50 to be semi-set later. Next, the semiconductor chips 16, 17 in the adjacent state to the previously bonded ones are bonded onto the semi-set bonding agent layer 51. Later, the semi-set bonding agent layer 51 is to be completely set. For example, the ceramic package 11 is coated with Ag paste to be heated at 100 deg.C for about five minutes for semi- setting step and then the semiconductor chips 16, 17 heated at about 100 deg.C are successively bonded. |
