发明名称 Verfahren zum Montieren von elektronischen Bauteilen auf Leiterplatten.
摘要 A method for mounting electronic parts on a printed board using a computer (15), an optical indicator (23) controlled by the computer (15) to optically indicate a position of insertion on the printed board into which an electronic part is to be inserted, and a parts locator (35) having a plurality of pockets and controlled by the computer (15) to rotate and open only one pocket is disclosed. According to the method of the present invention, parts taken out at random from a parts box are put into opened pockets of parts locator (35), or after the parts are inserted into the positions of insertion on the printed board indicated by the optical indicator (23), the remaining parts are put into the opened pockets of the parts locator (35). Subsequent mounting work can be performed only by taking out the parts from the pockets of the parts locator (35) and inserting the parts into the optically indicated positions.
申请公布号 DE69013976(T2) 申请公布日期 1995.04.20
申请号 DE1990613976T 申请日期 1990.05.15
申请人 FUJITSU LTD., KAWASAKI, KANAGAWA, JP 发明人 UCHIDA, KENJI, UTSUNOMIYA-SHI, TOCHIGI 321-01, JP;OHKUBO, KIYOMI, SHIMODATE-SHI, IBARAKI, 308, JP;MATUMOTO, MAKOTO, SHIMODATE-SHI, IBARAKI, 308, JP
分类号 B23P21/00;H05K13/00;(IPC1-7):H05K13/04 主分类号 B23P21/00
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