| 摘要 |
<p>A wafer processing apparatus (10) is provided with an assembly that effectively seals openings in a housing (11) that encloses a vacuum processing chamber (12) that are subject to heating. An opening cover, such as a quartz window (34) used permit radiant heat to enter the chamber (12) from radiant infrared lamps (32) on the outside, employs a hard metal seal (50). A frame (52) that holds the cover (34) to the housing (11) and presses it against the seal (50) is prevented from expanding under the influence of heat, such as from radiant lamps (32). The expansion is prevented, preferably by cooling the frame (52) with cooling tubes (64) on the surface of the frame (52). Alternatively, a high expansion coefficient spacer ring (68) may be employed that expands an amount equal to the expansion of the gap (62) that holds the cover (34) and seal (50). A further alternative employs a frame (52) of low coefficient of expansion material.</p> |
