| 摘要 |
<p>A process for manufacturing a multi-layer circuit board comprises applying a layer of a photoresist to the conducting surface of an inner layer and fixing the resin composition in a pre-selected pattern for example by exposing to UV radiation which results in polymerisation in the exposed areas. After removing the non-fixed areas by developing in an aqueous developing solution and etching in an etching solution, the fixed areas of resin composition remain in place on the inner layer and are directly adhered to the neighbouring insulating layer in an adhesion step. The preferred resin compositions according to the invention comprise a first photo-polymerisable resin component having an acid number from 15 to 75, a second epoxy resin component having unreacted epoxy groups, and a photoinitiator, the ratio of first to second resin components being at least 1:1.</p> |
