发明名称 METHOD OF FORMING POLYIMIDE PATTERNS ON SUBSTRATES
摘要 <p>Disclosed is a method of forming a pattern on a substrate. A first solution is formed of an organic solvent and monomers of diamine and dianhydride. The monomers are polymerized to form a polyamic acid soluble in the organic solvent. About 20 to about 95 % of the amic acid groups in the polyamic acid are imidized to form a partially imidized polyamic acid. A more concentrated solution of the partially imidized polyamic acid is formed. This can be accomplished by precipitating the partially imidized polyamic acid from the first solution and dissolving it in a second organic solvent to form a second solution. The second solution is applied to the substrate and the solvent is evaporated to form the coating of the partially imidized polyamic acid on the substrate. A portion of the coating is removed to form a pattern on the substrate and the remaining partially imidized polyamic acid is fully imidized on the substrate.</p>
申请公布号 WO1995010797(A1) 申请公布日期 1995.04.20
申请号 US1994008359 申请日期 1994.07.25
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