PROCESS FOR MANUFACTURING INTEGRATED MICROCIRCUITS.

摘要

The process involves: initially gluing a semiconducting crystal (7) at the face bearing the contact surfaces (8) to a polymer film (1); arranging and securing the polymer film (1) in a compression mould (13) so as to create a gap (14) between the surface of the compression mould (13) and the polymer film (1) along its entire length except in the vicinity of the contact surfaces (8); shaping the polymer substrate (23) of the integrated microcircuit; removing the polymer film (1) from the contact surfaces (8); heat-treating the substrate (23) and creating electrical connections between the contact surfaces (8) and the metal output terminals of the terminal frame.