Integrated circuit packaging structure.

摘要

A integrated circuit packaging structure comprises a wafer member (6) to which on one side at least one integrated circuit semiconductor chip (10) is bonded. Said wafer (6) is resiliently mounted on the periphery with the other side of said wafer being in broad area conformal thermal transfer with an external heat dissipating structure (5). The structure includes a peripheral resilient spacer (16) disposed along the edge of said wafer member (6) between said wafer member (6) and said heat dissipating means (5) forming a cavity therebetween, said cavity being filled with a viscous thermally conductive material (8).