| 摘要 |
<p>An apparatus and method for rapidly changing the temperature of a semiconductor wafer, in order to perform electrical tests or stress at elevated temperature, and then cool rapidly to ambient temperature. The apparatus is comprised of a wafer support 17, capable of supporting the wafer, mounted on top of a rapid thermal processing (RTP) illuminator 20 (lamps, preferably halogen), and including one or more probe needles 22, capable of contacting the wafer to perform electrical measurements. A semiconductor wafer 16 is placed upon the wafer support 17 and the RTP illuminator 20 located beneath is activated, rapidly elevating the wafer to the desired temperature. Electrical tests may be performed as desired during the process. <IMAGE></p> |
