Flip-chip semiconductor device.

摘要

The present invention provides flip-chip type semiconductor devices wherein the electrical terminals (4) on the flip-chip element (1) are bonded to corresponding terminals (5) on the base plate (3) or other substrate using an electrically conductive silicone elastomer (6) exhibiting a specified range of Young's modulus values and the space between the passivated active surface of the flip-chip element and the substrate is filled with an electrically insulating elastomeric sealant (7). The use of the conductive silicone elastomer and the elastomeric sealant prolongs the useful life of the device. <IMAGE>