| 摘要 |
A heat sink-spring clip assembly for mounting on a PQFP electronic package wherein leaf spring legs engage with the outermost diametrically opposed ends of the bumpers on the PQFP, and the assembly is positioned relative to the PQFP package by means of tabs which extend normally downwardly to engage the upper sides of the PQFP well above and out of contact with the electrical leads. |
