Method of forming a mask on a semiconductor substrate via photosensitive resin deposition, ammonia treatment and selective silylation

摘要

A photosensitive organic resin layer is formed on a semiconductor substrate. The resin layer is treated with ammonia before or after the resin layer is exposed. Then, the exposed organic resin layer is easily silylated. Due to the ammonia treatment, non-exposed portions of the organic resin layer is hardly silylated so that a high aspect ratio of patterning is realized.