发明名称 |
Chemical mechanical polishing slurry delivery and mixing system |
摘要 |
A method and apparatus for mixing and delivering a slurry polishing and etching a semiconductor device is described wherein the slurry chemicals are mixed at the point of use. An abrasive solution and a oxidant solution are stored in separate storage containers. When the polish/etch is to begin, each of the chemicals are pumped into a mixing chamber where they are mixed so as to form a slurry. The slurry is then immediately used to polish/etch a semiconductor device. Other chemicals may be added to the slurry during the polish/etch process so as to change the polish and/or the etch rate during the polish/etch process.
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申请公布号 |
US5407526(A) |
申请公布日期 |
1995.04.18 |
申请号 |
US19930085971 |
申请日期 |
1993.06.30 |
申请人 |
INTEL CORPORATION |
发明人 |
DANIELSON, DONALD D.;FELLER, ALLEN D.;CADIEN, KENNETH C. |
分类号 |
B24B37/04;(IPC1-7):H02N21/304;H01L21/306 |
主分类号 |
B24B37/04 |
代理机构 |
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代理人 |
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地址 |
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