发明名称 |
LOW THERMAL EXPANSION CORDIERITE AGGREGATE AND ITS BONDED BODY |
摘要 |
PURPOSE:To obtain cordierite aggregate and its bonded body having a low coefft. of thermal expansion in spite of the thick shape and excellent in thermal shock resistance. CONSTITUTION:Glass granules having a compsn. similar to that of cordierite, few defects and >=1mm diameter are crystallized to obtain the objective aggregate having 50mum average grain diameter. This aggregate and its bonded body exhibit hysteresis in the thermal expansion characteristics as the temp. is raised and dropped and the average coefft. of thermal expansion between room temp. and 1,000 deg.C is <=10X10-<7>/ deg.C. |
申请公布号 |
JPH07101772(A) |
申请公布日期 |
1995.04.18 |
申请号 |
JP19940151281 |
申请日期 |
1994.07.01 |
申请人 |
A G TECHNOL KK |
发明人 |
ICHII TOMOKO;SUZUKI KEIICHIRO;OKUMIYA SHOTARO |
分类号 |
B01D39/20;C03C10/08;C04B35/195 |
主分类号 |
B01D39/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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