Method for producing a semiconductor device having an improved adhesive structure

摘要

A method is provided wherein semiconductor device includes a package, a semiconductor chip provided on the package, an intermediate layer formed on the package, an adhesive layer formed on the intermediate layer, and a lid formed on the adhesive layer and sealing the semiconductor chip. The intermediate layer contains a major component which is the same as a major component of the package. The method includes screen printing the intermediate layer on a predetermined area of the package and the formation of a roughened surface by sintering the intermediate layer. The major component comprises, among other materials, alumina or alumina and glass.