| 摘要 |
PURPOSE:To correctly detect a position of a soldered part without being influenced by errors of a mounted position of a part, by storing data of a position and a shape of a soldering land on a substrate when no part is mounted yet, and measuring a distribution of the transmitted amount of X rays of the mounted substrate. CONSTITUTION:X rays are cast to a substrate 2 with no part mounted thereon, and data of a position and a shape of an end part of a soldering land are stored in a land data memory 8 with reference to an image of the transmitted X rays. Thereafter, the mounted substrate 2 is arranged at a predetermined position, to which X rays are cast from an X-ray projector 3. A distribution of the transmitted amount of X rays is measured by an X-ray detector 4 and input to an image-processing part 5, whereby an image of the distribution of the transmitted amount of X-rays is formed for tone substrate 2. The image of the distribution is input to a calculator 6, thereby to detect a position where the transmitted amount is minimum at a central mounting axis of a chip part. A position of a soldered part of the part is calculated from a relation between the position of the end part of the soldering land read out from the memory 8 and data of the position where the transmitted amount is minimum. |
