| 摘要 |
In-situ removal of material, such as solder paste (12), from openings (26-26) in a stencil (22) is accomplished by imparting a vibrational motion to the stencil. In practice, the stencil (22) may be vibrated by one or more DC solenoids (28-28), each having its plunger (28) in contact with the periphery of the stencil and each excited with AC so that the solenoid plunger undergoes a linear oscillation to vibrate the stencil.
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