Polyamide resin composition

摘要

There is disclosed a polyamide molding composition characterized by excellent moldability, release and lubricity, said composition comprising: (A) 100 parts by weight of a polyamide resin; (B) 0.1 to 120 parts by weight of a polydiorganosiloxane that contains neither carboxyl nor amino groups; and (C) a polysiloxane selected from the group consisting of carboxyl-containing polydiorganosiloxane and amino-containing polydiorganosiloxane, the amount of said polysiloxane (C) being 0.01 to 50 parts by weight for each 100 parts by weight of said component (B).