发明名称 |
Fluxless soldering of copper |
摘要 |
A method of soldering a copper layer without the use of fluxing agents by exposing the copper layer to a fluorine-containing plasma. Solder is then placed onto the surface of the copper layer and reflowed. Reflow can take place at low temperatures, atmospheric pressure and in an inert or oxidizing atmosphere using standard solder reflow equipment.
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申请公布号 |
US5407121(A) |
申请公布日期 |
1995.04.18 |
申请号 |
US19930155020 |
申请日期 |
1993.11.19 |
申请人 |
MCNC |
发明人 |
KOOPMAN, NICHOLAS G.;NANGALIA, SUNDEEP |
分类号 |
B23K1/20;B23K35/38;H05K3/34;(IPC1-7):B23K1/20 |
主分类号 |
B23K1/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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