| 摘要 |
A soldering process and apparatus for soldering difficult to reach junctions. Small containers, just large enough to accommodate the junctions are filled to overflowing from a pot of liquid solder. Once filled the flow of solder is terminated and the junction dipped into the container. The meniscus on the liquid solder in the container establishes a consistent level enabling a mechanized process to dip the junctions the same depth each time. Between dips the container is refilled. The size of the container limits the exposure of other adjacent devices to the heat of the solder and also provides a limited quantity of solder to the junction thus providing a consistent soldered connection.
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