Halbleiteranordnung mit Zuleitungen.

摘要

A semiconductor device includes a metallic electrode (4) formed on a semiconductor substrate (1), and a metallic terminal (11E) formed on a metal base through an insulating material, in parallel to the metal electrode (4). A metallic wire (12) electrically connects the metallic electrode to the metallic terminal. In a metallic conductor (23) having a current capacity larger than that of the metallic wire, one end is in contact with the metallic electrode, and the other end is in contact with the metallic electrode.