发明名称 IC LEAD FRAME MADE OF FE-CU ALLOY AND MANUFACTURE THEREOF
摘要 PURPOSE:To attain good Young's modulus, yield strength, conductivity and high etching factor by setting the etching factor at a specified value or above for a specified pin interval of lead frame. CONSTITUTION:The two-phase alloy of Fe-Cu has a chemical composition of 20-60wt.% of Cu, 0.1-10wt.% of Cr, 0.005-3.5wt.% of Ti, 0.001-1.5wt.% of Zr, 0.001-1.1wt.% of Al, 0.001-1.5wt.% of Mo, and the remainder of Fe and inevitable impurities. The etching factor is set at 2.3 or above when the pin interval of lead frame is 100mum. This method produces an IC lead frame of Fe-Cu alloy having high stiffness, electric conductivity of 10% or above, etching factor of 2.3 or above, and the corner part excellent in linearity and smoothness.
申请公布号 JPH0794650(A) 申请公布日期 1995.04.07
申请号 JP19930237849 申请日期 1993.09.24
申请人 NIPPON STEEL CORP 发明人 NISHIMURA SATORU;KOYAMA KAZUO;SHIODA KOSAKU
分类号 C22C9/00;C22C38/00;C22C38/16;H01L23/48;(IPC1-7):H01L23/48 主分类号 C22C9/00
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