| 摘要 |
PURPOSE:To eliminate the need for soldering with a flexible part and to improve productivity and reliability by extending a hard substrate into a rigid part continuously to the base film at the flexible part. CONSTITUTION:An extended part 20 formed by a hard substrate is extended into rigid parts 1B and 2B continuously to a base film 4B of a flexible part 3B. For example, a prepreg or a hard resin which has nearly the same thickness as the base film 4B and can be adhered is used. The extended part 20 is held by metal conductors 5, 5 so that it continues to the base film 4B and a specific circuit pattern is formed by etching, etc. Then, the base film 4B and the extended part 20 are covered with a coverlay 6. Then, copper-clad lamination plates 9, 9 are laminated via the prepregs 8, 8, thus forming rigid parts 1B and 2B and hence reducing the dimensional change in the extended part 20 and reducing the positional deviation between the extended part 20 and the lamination plate. |
