| 摘要 |
PURPOSE:To provide a highly reliable circuit board in which the cracking of ceramic board and the exfoliation of conductive layer are prevented during operation of a semiconductor element. CONSTITUTION:A planar conductive layer 3c is bonded integrally to a ceramic board, 2a through an active metal layer 6 formed on the surface thereof. The conductive layer 3c is connected with a lead out terminal 4a and an unbonded part 7 is provided between the conductive layer 3c and the ceramic board 2a. The active metal layer 6 is composed of a brazing material containing at least one kind of active metal selected from Ti, Zr, Hf and Nb. The lead out terminal 4a has a bent part 9 for allowing elongation/contraction in the axial direction. |
