发明名称 PHOTOSENSITIVE RESIN COMPOSITION AND PRODUCTION OF RELIEF PATTERN
摘要 PURPOSE:To provide a photosensitive resin compsn. excellent in film characteristics, heat resistance, adhesive property and image forming property without requiring a troublesome producing process and without causing contamination by a chloride, etc. CONSTITUTION:This photosensitive resin compsn. is a positive type photosensitive resin compsn. contg. an alkali-soluble polymer having carboxyl groups and/or phenolic hydroxyl groups and a compd. generating an amine compd. by irradiation with light as essential components. The top of a coating film of this photosensitive resin compsn. is irradiated with active light through a patterned mask and the irradiated part is removed by development to produce the objective relief pattern.
申请公布号 JPH0792682(A) 申请公布日期 1995.04.07
申请号 JP19940088384 申请日期 1994.04.26
申请人 HITACHI CHEM CO LTD 发明人 HAGIWARA HIDEO;KAJI MAKOTO;KOJIMA YASUNORI
分类号 G03F7/004;G03F7/037;G03F7/039;H01L21/027;H01L21/312;(IPC1-7):G03F7/039 主分类号 G03F7/004
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