发明名称 EQUIPMENT FOR PUNCHING TAPE AND BONDING IT TO LEAD FRAME
摘要 PURPOSE:To improve the accuracy of the bonding position of a tape to a lead frame, by providing aligning pins in a tape punching female-die, and by eliminating the clearance between the aligning pin and an aligning pin hole while using the tapered aligning pin. CONSTITUTION:A tape punching male-die means A, a tape punching female-die means B and a tape bonding stage C are provided respectively. The tape punching male-die means A has a tape punching male-die 20 and a male-die guiding block 30. The tape punching female-die means B has a tape punching female-die block 50 and a punched-tape receiving part 60. In the tape punching female-die block 50, a punching hole 40 wherethrough the end part of the tape punching male-die 20 is so passed in an engaging way that a tape is punched is bored throughly. In the end part of the punched-tape receiving part 60, an air-type sucking part which receives a punched tape while it is passed in an engaging way through the punching hole 40 is provided. Further, the tape punching male-die means A and the tape punching female-die means B can be superimposed on each other or separated from each other, via tapered engagement parts 51.
申请公布号 JPH0794536(A) 申请公布日期 1995.04.07
申请号 JP19930239677 申请日期 1993.09.27
申请人 TOPPAN PRINTING CO LTD 发明人 TANIGUCHI YOSHIHIDE;YOSHIDA MITSUTERU
分类号 H01L21/52;(IPC1-7):H01L21/52 主分类号 H01L21/52
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