发明名称 IMPREGNATED CATHODE, IMPREGNATED CATHODE ASSEMBLY, AND MANUFACTURE OF IMPREGNATED CATHODE ASSEMBLY
摘要 PURPOSE:To provide an impregnated cathode and an impregnated cathode assembly which require no complicated work of confirming the surface and reverse surface of the impregnated cathode when the impregnated cathode is house in a cup, and a method for manufacturing the impregnated cathode in which a sufficient connecting strength can be provided between a porous base body and a supporting cup without using a brazing material. CONSTITUTION:An impregnated cathode 1 is formed of a porous base body 12 consisting of a high melting point metal and an electron emitting material impregnated in the porous base body, and platinum metal layers 14 are formed on the surface and reverse surface of the porous base body 12. An impregnated type cathode assembly is formed of a cup consisting of a high melting point metal, and the impregnated type cathode 10 housed in the cup, and the inner surface of the cup 20 is fused to the platinum metal layer 14 formed on one surface of the porous base body 12. A method for manufacturing the impregnated type cathode assembly comprises fixing the porous base body into the inner surface of the cup, and then impregnating the porous base body with the electron emitting material.
申请公布号 JPH0794074(A) 申请公布日期 1995.04.07
申请号 JP19930256449 申请日期 1993.09.20
申请人 SONY CORP 发明人 HARA MICHIO;NAKAHIRA TADAKATSU;KODAMA TAKESHI
分类号 H01J1/28;H01J1/14;H01J9/04 主分类号 H01J1/28
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