发明名称 ELEMENT SEPARATION TYPE COMPOSITE MICROWAVE CIRCUIT MODULE
摘要 PURPOSE:To improve the yield of a composite microwave circuit module and the degree of freedom for its production with respect to an element separation type composite microwave circuit module formed by integrating an active element and a passive element constituting a microwave band circuit on the same substrate. CONSTITUTION:This composite microwave circuit module 1 consists of a base substrate 2, element substrates 3 to 7 and a base plate 8. Recessed parts 2a to 2e are formed on the substrate 2 by hollowing out a substrate material upper than an intermediate layer in accordance with the contours of resective substrates 3 to 7. The substrates 3 to 7 are respectively engaged with the recessed parts 2a to 2e and electrically connected with them through bonding wires. The substrates 3 to 6 have block-like shapes with absolute minimum size, each of the substrates 4 to 6 mounts a filter constituted of a strip line or the like and a passive element such as a directional coupler on its intermediate layer and each of the substrae 3, 7 mounts an active element such as a transistor and a diode on its intermediate layer.
申请公布号 JPH0794901(A) 申请公布日期 1995.04.07
申请号 JP19930196659 申请日期 1993.06.30
申请人 NEC CORP 发明人 KUSAMITSU HIDEKI;KOIZUMI TAKAO
分类号 H01L25/04;H01L25/18;H01P1/00;H01P1/04;H01P3/08;H01P5/02;H01P11/00;H05K3/46 主分类号 H01L25/04
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