发明名称 CIRCUIT BOARD
摘要 <p>PURPOSE:To provide a circuit board where a wiring conductor and a circuit conductor are clad firmly and the wiring conductor and the circuit conductor are electrically, positively, and properly connected. CONSTITUTION:In the title circuit board where a circuit conductor 4 consisting of copper is clad on the outer surface of an insulation substrate 1 in that a wiring conductor 2 consisting of at least one type out of tungsten, molybdenum, and manganese is provided so that one part of the circuit conductor 4 contacts the wiring conductor 2, a plating layer 3 consisting of copper is included at the contact part between the wiring conductor 2 and the circuit conductor 4 and at the same time the surface roughness of the wiring conductor 2 where the plating layer 3 contacts is set to 0.7-1.0mum (center line average roughness (Ra)) and 4.0-8.0mum (maximum height (Rmax)).</p>
申请公布号 JPH0794839(A) 申请公布日期 1995.04.07
申请号 JP19930233074 申请日期 1993.09.20
申请人 KYOCERA CORP 发明人 AIHARA KENICHI
分类号 H05K1/09;H05K3/24;H05K3/46;(IPC1-7):H05K1/09 主分类号 H05K1/09
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