Sealed microcomponent housing and method of encapsulation in such a housing

摘要

The sealed housing, capable of accommodating active or passive microcomponents, comprises a receptacle (10) made of thermoplastic or thermosetting material overmoulded onto output electrical contacts (14, 20) of the microcomponent (18), and a cover forming the receptacle and with it defining a cavity, containing a fluid, for accommodating the microcomponents. The material of the receptacle is also overmoulded onto a metal crown (12) and the cover (22) is of metal. It is fixed and sealed onto the crown, by soldering, brazing or even bonding.