COOLING STRUCTURE OF POWER UNIT

摘要

PURPOSE:To cool even such parts that are to be used at a low temperature by using the cooling fan used for a semiconductor device for power to be forcibly cooled. CONSTITUTION:The inside of a case main body 1 is divided into an upper room 13 and lower room 12 with a partition plate 3. In addition, a space 14 is formed on the front side of the front plate 1a of the case 1 by providing a panel 2 and a air passage 20 is formed through the case 1 by providing an upper and lower air vents 11 and 10 through the front plate 1a and an exhaust hole 9 and intake hole 8 through the rear plate 1b of the case. In the upper room 13, cooling fins 5 having air vent grooves on their lower surfaces are provided in contact with the exhaust hole 9 and a semiconductor device 4 for power constituting part of a power supply circuit is put on the fins 5. Adjacently to the fins 5, a cooling fan 6 is provided so as to generate an air flow from the intake hole 8 to the exhaust hole 9. In addition, parts 7 to be used at a low temperature constituting part of the power circuit are set in the lower room 12.