| 摘要 |
PURPOSE:To provide a semiconductor in which the pin count can be increased without increasing the size of package or decreasing the pitch of the pin. CONSTITUTION:The semiconductor device comprises a semiconductor element 13, a package 12 sealing the semiconductor element 13, a plurality of lead terminals 20 connected electrically with the semiconductor element 13 and projecting from the package 12, and pin terminals 23 provided in conjunction with the lead terminals 20 each having one end connected electrically with the semiconductor element 13 and the other end projecting from the package. |
