| 摘要 |
PURPOSE:To eliminate the adverse influence of the curing shrinkage stress of a resin having good moisture resistance and to enhance the reliability of the bump electrode juncture of input terminals by applying the resin having the good moisture resistance only on the side of a driving IC having an input terminal. CONSTITUTION:The first resin 8 having a good flow property is injected at the boundary of the driving IC 3 and lower substrate 1 of the packaging structure of the display device formed by connecting the driving IC 3 onto circuit wirings 14 for driving disposed on the lower substrate 1 and thereafter, the first resin 8 is coated with the second resin 5 having the good moisture resistance only on the side of the driving IC 3 having the input terminal. The bump electrode juncture C of the input terminal disposed at the driving IC 3 is, therefore, eventually protected by the second resin 5 having the good moisture resistance, by which the infiltration of moisture is lessened. Then, the input terminal is prevented of an increase in the electric resistance by generation of corrosion in the bump juncture as experienced heretofore. In addition, the stresses on the lower substrate 1 and the driving IC 3 are minimized. |
