| 摘要 |
PURPOSE:To improve the form and the adhesion of a conductor pattern, and simply effectively enable inspection before pattern plating. CONSTITUTION:An interlayer insulating layer I1 is formed on a board 1 by performing exposure development and curing treatment after the coating of photosensitive resin. By sputtering metal capable of improving the adhesion of a conductor pattern C2, a Cr thin layer L1 as a first layer metal thin layer is formed on the interlayer insulating film I1. A Cu thin film L2 as a second layer metal thin layer is formed on the Cr thin layer L1 by sputtering. A Cr thin layer L3 as a third layer metal thin layer is formed on the Cu thin layer L2 by sputtering. On the Cu thin layer L3, plating resist 3 is formed, the Cr thin layer L3 is eliminated, and the Cu thin layer L2 is partially exposed. A copper-plated layer L4 is formed on the exposed Cu thin layer L2. The plating resist 3 and the metal thin layers L1-L3 are eliminated. The above process is repeated. |
