CERAMIC MULTILAYERED BOARD AND ITS MANUFACTURE

摘要

PURPOSE:To obtain a ceramic multilayered board which can evade imperfect conduction after baking, between an Au based conductor connection via and an Ag based inner conductor wiring. CONSTITUTION:In a ceramic multilayered board obtained by stacking in order necessary n-green sheets 20-1...20-n and thermocomprssion-bonding them, an Au based conductor connection via 26 which connects an Au based outer conductor wiring 22 on the first layer green sheet 20-1 with an Ag based inner conductor wiring 24 on the second layer green sheet 20-2 is connected with an Ag based inner conductor wiring 24 through an Ag based conductor pad 30. The size of the pad 30 is equivalent to the diameter of the connction via containing at least position deviation amount. Ag based conductor is applied to the connection via 28 which connects mutually the inner conductor wirings 24.