发明名称 METHOD AND APPARATUS FOR MOLDING
摘要 PURPOSE:To reduce the quantity of resin to be used in a resin sealed package. CONSTITUTION:In a transfer molding apparatus 20, a slider 31 is laid on a runner 27 such that the slider 31 can advance or retracts in the direction for increasing or decreasing the cross-sectional area of channel in the runner. After a resin 42 in a pot 24 is substantially pushed out, the slider 31 is advanced to constrict the channel of the runner 27. Consequently, the quantity of resin 42 being left finally in the pot 24 and the main runner 27 is minimized and thereby useless consumption of the resin 42 can be minimized. Since the runner 27 has a predetermined cross-sectional area of channel, the cavity 23 can be filled correctly with the resin 42. Since each cavity can be additionally fed with the resin 42 and the fully filled resin is compacted, the resin sealed package can be molded correctly.
申请公布号 JPH0794542(A) 申请公布日期 1995.04.07
申请号 JP19930261864 申请日期 1993.09.24
申请人 HITACHI LTD 发明人 SOBA TAKUMI;SAKAMOTO TOMOO
分类号 B29C45/26;B29C45/02;B29L31/34;H01L21/56;(IPC1-7):H01L21/56 主分类号 B29C45/26
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