| 摘要 |
PURPOSE:To provide a semiconductor eligner which satisfies the fineness of machining dimensions, at the same time simplifies an optical system including alignment, and performs a stable and accurate overlapping. CONSTITUTION:Laser beams with each different wavelength generated by first and second resonators from an ultraviolet laser light source irradiation part 10 are applied onto a wafer 14 via a coaxial optical system consisting of integrator 11, a reticle 12. and a demagnification projection lens 13 and an XY stage 15 is controlled by a stable position detection by comparison of on-axis and off-axis by an aligner 16 without attenuating the reflection light from the mark on the wafer 14 using laser beams from the first resonator as a light source for alignment. |
