| 摘要 |
PURPOSE:To allow provision of circuit wiring layers on the opposite sides of a cap by interconnecting the circuit wiring layers formed on the surface and the rear of the cap through an electrical connecting means provided on the cap. CONSTITUTION:A cap 30 is made of ceramic with the upper fringe part 30a thereof extending oppositely to a circuit wiring layer 15. The cap 30 is bonded to the cap seal surface 13b of a board 10 through a sealing material 31. Circuit wiring layers 32, 33 are formed, respective, on the surface of the cap 30 and the rear of the upper fringe part 30a and interconnected through a via hole 34 made through the cap 30. A surface mounting device 35 is mounted on the circuit wiring layer 32 formed on the surface of the cap 30 through a solder 36. A thermosetting conductive adhesive 37, e.g. Ag epoxy or Ag silicon, is placed between the circuit wiring layer 33 formed on the rear of the upper fringe part 30a and the circuit wiring layer 15 formed on the surface of the board 10 in order to connect them electrically.
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